Sikafloor®-262 AS N

• Contributes towards satisfying Indoor Environmental Quality (EQ) Credit: Low-Emitting Materials under LEED® v4

• Contributes towards satisfying Materials and Resources (MR) Credit: Building product disclosure and optimization — Environmental Product Declarations under LEED® v4

• Coating Compatibility AA-P 128, Sikafloor®, Polymer Institut, Report No. P 5541

• Material testing PV 3.10.7, Sikafloor®-262 AS N, HQM, Report No. 14-04-14201871-

• Particle Test ISO 14644-1, Sikafloor®-262 AS N, CSM Fraunhofer, Certificate No.

• Outgassing emissions VDI 2083-17, Sikafloor®-262 AS N, CSM Fraunhofer, Certifica

• Biological Resistance ISO 846, Sikafloor®-262 AS N, No. SI 1412-740

• CE marking and declaration of performance based on EN 13813:2002 Screed material and floor screeds — Screed material — Properties and requirements — Synthetic resin screed material

• CE marking and declaration of performance based on EN 1504-2:2004 Products and systems for the protection and repair of concrete structures — Surface protection systems for concrete — Coating

Solvent-free epoxy

12 months from date of production

The Product must be stored in original, unopened and undamaged sealed packaging in dry conditions at temperatures between +5 °C and +30 °C. Always refer to the packaging.

Refer to the current Safety Data Sheet for information on safe handling and storage.

97 %

97 %

Note: This product fulfils the requirements of ATEX 137.

Note: Measurement results can be affected by ESD clothing, ambient conditions, measurement equipment, cleanliness of the floor and the test personnel.

Beware of condensation. The substrate and uncured applied product must be at least +3 °C above the dew point to reduce the risk of condensation or blooming on the surface of the applied product. Low temperatures and high humidity conditions increase the probability of blooming.

Please refer to the Product Data Sheet of the individual epoxy primer.

Note: Times are approximate and will be affected by changing ambient conditions, particularly temperature and relative humidity.

Note: Times are approximate and will be affected by changing ambient conditions, particularly temperature and relative humidity.

Note: Consumption data is theoretical and does not allow for any additional material due to surface porosity, surface profile, variations in level, wastage or any other variations. Apply the Product to a test area to calculate the exact consumption for the specific substrate conditions and proposed application equipment.

Reduced conductivity due to excessive layer thickness

Note: Applying the Product in excess of the stated thickness will result in reduced conductivity.

Select the most appropriate equipment required for the project.

MIXING

• Electric single-paddle mixer (300 to 400 rpm)

• Electric double-paddle mixer (> 700 W, 300 rpm to 400 rpm)

• Scraper

• Clean mixing containers

APPLICATION

• Mixed material carrier

• Large-surface scraper no. 656, toothed blades no. 25 (www.polyplan.com)

• Steel spike rollers

IMPORTANT

Reduced service life due to incorrect treatment of cracks

The incorrect assessment and treatment of cracks may lead to a reduced service life and reflective cracking.

1. For static cracks, ensure the width is suitable for overcoating with Sikafloor®-262 AS N.
2. For dynamic cracks, ensure the movement is within the movement capacity of Sikafloor®-262 AS N.

TREATMENT OF JOINTS AND CRACKS

Construction joints and existing static surface cracks in substrate require pre-treating before full layer application. Use Sikadur® or Sikafloor® resins.

SUBSTRATE CONDITION

Cementitious substrates must be structurally sound and of sufficient compressive strength (minimum 25 N/mm²) with a minimum tensile strength of 1.5 N/mm².

Substrates must be clean, dry and free of contaminants such as dirt, oil, grease, coatings, laitance, surface treatments and loose friable material.

IMPORTANT

Surface defects due to voids in the substrate

Voids and blow holes in the substrate will weaken the surface and damage the covering Product if not repaired during the preparation process.

1. Fully expose blow holes and voids during surface preparation to identify the required repairs.

1. Remove weak cementitious substrates.
2. Prepare cementitious substrates mechanically using abrasive blast cleaning, abrasive planing or scarifying equipment to remove cement laitance.
3. Before applying thin layer resins, remove high spots by grinding.
4. Before applying the Product, remove all dust, loose and friable material from the application surface with an industrial vacuuming equipment.
5. Level the surface or fill cracks, blow holes and voids with products from the Sikafloor®, Sikadur® and Sikagard® range of materials.

Substrate levelling for conductive floors

Note: The concrete or screed substrate has to be primed or levelled in order to achieve an even surface. Unevenness influences the film thickness and thus the conductivity.

For additional information on products for leveling and repairing defects, contact Sika® Technical Services.

SUBSTRATE PREPARATION OF NON-CEMENTITIOUS SUBSTRATES

For information on substrate preparation of non-cementitious substrates, contact Sika® Technical Services.

FILLED MIXING PROCEDURE

1. Mix Part A (resin) until the coloured pigment is dispersed and a uniform colour is achieved.
2. Add Part B (hardener) to Part A.
3. While mixing Parts A + B, gradually add the required filler or aggregates.
4. IMPORTANT Do not mix excessively. Mix for a further 2 minutes until a uniform mix is achieved.
5. To ensure thorough mixing, pour materials into another container and mix again to achieve a smooth and uniform mix.
6. During the final mixing stage, scrape down the sides and bottom of the mixing container with a flat or straight edge trowel at least once to ensure complete mixing.

UNFILLED MIXING PROCEDURE

1. Mix Part A (resin) until the coloured pigment is dispersed and a uniform colour is achieved.
2. Add Part B (hardener) to Part A.
3. IMPORTANT Do not mix excessively. Mix Part A + B continuously for ~3 minutes until a uniformly coloured mix is achieved.
4. (Optional) For vertical application, gradually add between 2.5 % and 4 % by weight of flooring resin of Sika® Extender T.
5. If additional materials were added, mix for a further 2 minutes until a uniform mix is achieved.
6. To ensure thorough mixing, pour materials into another container and mix again to achieve a smooth and uniform mix.
7. During the final mixing stage, scrape down the sides and bottom of the mixing container with a flat or straight edge trowel at least once to ensure complete mixing.

IMPORTANT

Damaged finish due to heating with fossil fuel heaters

Fossil fuel heaters powered by gas, oil or paraffin produce large quantities of both carbon dioxide and water vapour, which may adversely affect the finish.

1. For temporary heating, use only electrically powered warm air blower systems. Do not use gas, oil, paraffin or other fossil fuel heaters.

IMPORTANT

Apply approved reference area before full system application

Apply a reference area before the application of a full system. The reference area must be assessed and accepted by all parties before full project application.

IMPORTANT

Indentations in resin due to high temperature combined with high point loading

Under certain conditions, underfloor heating or high ambient temperatures combined with high point loading may lead to indentations in the resin.

IMPORTANT

Protect from moisture

After application, protect the Product from damp, condensation and direct water contact for at least 24 hours.

Preconditions

IMPORTANT Do not blind the primer.The conductive priming coat has been applied and has dried tack-free all over.

1. Pour the mixed Product onto the surface. For the consumption, refer to Application Information.
2. Apply the Product evenly over the surface with a serrated trowel.
3. Turn the serrated trowel and smooth the surface for an aesthetically higher grade of finish.
4. IMPORTANT This process must happen within 10 minutes of application. Back roll the surface in two directions at right angles with a spike roller.

IMPORTANT

Temporary moisture barrier required if substrate moisture exceeds 4%

If the substrate moisture content measured with the CM-method is > 4% by weight, apply a temporary moisture barrier consisting of Sikafloor® EpoCem®.

1. Contact Sika technical services for more information.

Clean all tools and application equipment with Sika® Thinner C immediately after use. Hardened material can only be removed mechanically.